Quality system management: We have passed ISO9001, ISO14001 quality system certification
We have the advanced international level of production line for packaging and testing semiconductor device
Engaged in the packaging and testing services of semiconductor discrete devices and integrated circuits
Manufacturing Equipment
Hottech has 328 advanced fully automated production equipment imported from abroad to improve production efficiency,reduce manufacturing costs and provide brand competitiveness.Excellent semiconductor component products are manufactured through standardized and streamlined processes.
Die Bonding Workshop
Advanced Equipment：
- ● 'ASMLotus-E'
- ● 'ASM838'
- ● 'ASM830'
- ● 'LDAB'
- ● 'ASMLotus-R'
- ● 'XZD SMA/SMAFL'
- ● 'ASM830Plus'
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Die Bonding Workshop
Wire Bonding Workshop
Molding Workshop
Forming workshop
Testing Workshop
Manufacturing Process
Integrated manufacturing process of die bonding, wire bonding, injection molding, molding, testing and packaging
Package Form
Hottech,certified as a national high-tech enterprise ,is a domestic professional enterprise in design,manufacturing and sale of semiconductor with around 30 years of industry experience.